Overview

Due to a retirement in our Back End function, we have a new opportunity for a Back End Process Development expert to join the expanding team at Pragmatic Semiconductor! Reporting to the Process Development Engineering Manager, this is a fantastic opportunity for someone to be the technical authority in Back End processes, advising on a range of topics to develop our processes and competencies.

The Principal Process Development Engineer will be responsible for developing laser release, die singulation (saw dice and laser dicing) and debonding processes.

The ideal candidate will possess proven experience in this area, a track record of innovation and development, a dynamic attitude to problem solving, and want to be part of a dynamic team developing groundbreaking innovation.

We are offering a highly competitive benefits package for this position, including Visa/Relocation support to the North East of England, where our new, state of the art fab is based.

Key tasks

• Lead the development of new and novel Back End processes as well as improving current processing in die singulation, laser processing and wafer on frame debonding.
• Lead development of new machines or the required upgrades to existing tools by working directly with machine manufacturers, leading projects from concept to handover to operations.
• Build relationships and demonstrate collaboration with internal cross functional teams, as well as external parties such as equipment manufacturers, customers and inlay assembly partners.
• Demonstrate independent judgement in methods, techniques and evaluation criteria in complex problem solving.
• Lead teams in working on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors.
• Lead and contribute to the development of company objectives.
• Use conceptual thinking to resolve significant and unique issues, bringing in projects on time and on budget.
• Lead by example and empower others by providing mentoring, training and encouragement.
• Develop an excellent level of understanding of inlay test equipment (R2R tester, inlay reliability bend testing, functional and VNA testing), the processes, results and be able to interpret the data to make informed decisions.
• Ensure SOPs and Risk assessments are created as required. Lead route cause analysis using quality tools such as 8D, and 5 whys, create and lead FMEAs and capability analysis.
• Report results in a clear and concise manner to the leadership team, and ensure technical reports are produced with a level of clarity and content for peer review.

Qualifications and training

A suitable candidate for this role would ideally be educated to Bachelor’s degree level (Master’s degree would be preferable) or would possess equivalent experience. Significant experience would be preferred, given the level of the role.

Skills and experience

• Significant experience of Back End process development, in particular laser processes and mechanical dicing.
• Proven skills in problem solving of complex issues.
• Experience in providing leadership and mentoring.
• Excellent relationship building skills, both with internal and external stakeholders.
• Excellent ability to communicate technical reports effectively to senior management.

Pragmatic is committed to equity, equality, diversity, and inclusion; we strive to welcome everyone and create inclusive teams. We celebrate difference and encourage everyone to be themselves at work. Please let us know if you would like any adjustments to our application and interview process.