Sedgefield
·
Hybrid Remote
Senior Manager R&D Packaging & Assembly
Do you want to play a key role in driving forward Pragmatic’s emerging technology? If you are driven, ambitious and have a strong background in semiconductor manufacturing, we'd love to hear from you!
We usually respond within a week
Overview
- The R&D Packaging & Assembly Senior Manager will be responsible for day-to-day activities of the R&D assembly team, part of the R&D group, and deliver on the organization roadmap for future FlexIC assembly technologies, working closely with other teams in R&D, Technology, Operations as well as external development partners.
Key tasks
- Lead and manage a team of engineers and technicians responsible for FlexIC packaging and assembly development activities.
- Drive package integration efforts, package and enabling technology development for new FlexIC products and technologies.
- Set and document package specifications, design rules, and assembly process requirements for outsourced semiconductor assembly and test (OSAT) partners.
- Collaborate with cross-functional teams, including design engineers, process engineers, and customers, to enable successful assembly development and integration.
- Provide technical leadership and expertise in FlexIC packaging and assembly processes, materials, and technologies.
- Develop, review, and approve standard operating procedures (SOPs) and other documentation for packaging processes and equipment.
- Support investigation of assembly process issues, identify and implement process improvements, and drive continuous improvement initiatives.
Qualifications and training
- Degree or post-graduate in electronics, mechanical engineering, electronics engineering, MEMS or another relevant discipline; or equivalent experience.
- In depth knowledge of semiconductor packaging and assembly technologies.
Skills and experience
- Experience with semiconductor packaging techniques including electroplating, redistribution layers, wafer bumping, etc.
- Experience with semiconductor, MEMs and flexible electronics assembly techniques including direct die attach, flip chip, thermo bonding, solder, wire bonding, etc.
- Proficiency in package design, development, and integration for new semiconductor products.
- Ability to set package specifications, design rules, and assembly process requirements.
- Excellent project management skills to lead cross-functional teams and drive successful assembly development.
- Expertise in developing and reviewing standard operating procedures (SOPs) and documentation.
- Familiarity with packaging equipment, facilities, and process qualification.
- Strong problem-solving and continuous improvement mindset.
- Effective communication and leadership skills to manage teams and collaborate with internal and external stakeholders.
- Team leading/management experience is desired although not essential.
Pragmatic is committed to equity, equality, diversity, and inclusion; we strive to welcome everyone and create inclusive teams. We celebrate difference and encourage everyone to be themselves at work. Please let us know if you would like any adjustments to our application and interview process.
- Locations
- Sedgefield
- Remote status
- Hybrid Remote
Reward and Benefits
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Private Medical Insurance
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BUPA Cash Plan
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Death in Service
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Income Protection
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Various Subscriptions
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Mental health first aiders
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Flu vaccinations
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Lifestyle benefits
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Visa fee reimbursement
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Recruitment bonus scheme
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Social events
Our Culture
At Pragmatic, we have a highly skilled, passionate and driven team from diverse backgrounds. We have employees from over a dozen countries, covering 5 continents. The company culture is one that promotes an open and collaborative environment where everyone’s input is valued. Our employees feel fortunate to work in such an innovative and inspiring place, with a talented and dedicated team all focused on reinventing electronics to address real world challenges.
Sedgefield
·
Hybrid Remote
Senior Manager R&D Packaging & Assembly
Do you want to play a key role in driving forward Pragmatic’s emerging technology? If you are driven, ambitious and have a strong background in semiconductor manufacturing, we'd love to hear from you!
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