Overview

• Develop thin film deposition processes including metal, dielectric and semiconductors for Pragmatic’s flexible IC production. 
• One important task will be to improve existing processes, moving them from development into mass manufacturing, demonstrating acceptable performance via Cp/CpK, throughput and defectivity, on Pragmatic’s recently installed 300mm wafer production line.
• Further activities will centre upon the development of similar but more advanced processes, in tandem with the Research team, to rapidly establish manufacturable paths to next-generation flexible IC devices.

Key tasks

• Optimise TFT Barrier Layer deposition process, whilst delivering aggressive throughput and quality improvements.
• Develop semiconductor deposition to meet TFT performance consistency at scale.
• Improve resistor layer performance uniformity, and in consort with vendors, develop next-generation hardware to provide robust deposition solutions for advanced tech nodes.
• Establish comprehensive characterisation of sputtered films and devise introductory process controls for current and new processes.
• Train a PVD engineer to support the above tasks.

Qualifications and training

• Degree in Physical Sciences, Electronics Engineering
• PhD with an emphasis on practical micro/nanoscale device fabrication is preferred although not essential. 
• Microsoft. 
• SQL/databases, 6-sigma

Skills and experience

• Previous experience of Micro-electronics fabrication, particularly in vacuum deposition of thin films
• Good knowledge and experience of characterisation techniques for microstructure fabrication, such as semiconductor, AFM, Surface Profilometery, Ellipsometry
• Excellent knowledge of Physical Vacuum Deposition techniques including especially plasma-based methods.
• Good track record of industrial experience in device fabrication process development.
• Competence at efficient experimental practise and design techniques