Overview

• A Process Engineer for Wet Etch will be leading Production activities on the RENA and Siconnex equipment in both FL001 and FL002 lines. 
• Both metal and metal-oxide layers are wet-etched in our technology and the pattern fidelity of these layers is important. As well as maintaining etch processes, the Engineer will be in charge of (wet) resist strip processes and wet clean steps.
• Together these processes will be maintained and continuously improved through Process Checks, SPC and formal Cp/CpK reviews.

Key tasks

• Provide Production Engineering cover to the FlexLogIC-001 (200mm, RENA) & future FlexLogIC (300mm, Siconnex) production lines.
• Improve turn-around between check completion and returning the tool to production use (if check unsatisfactory) by preparing appropriate OCAPs and training for Technicians.
• Assisting with training of Production Engineering Technicians to enable coverage outside of Office Hours.
• Work on SPC improvement objectives to improve tool performance and prepare OCAP documents to recover Process.
• Diagnose, troubleshoot and resolve yield impacting issues on Wet-Etch/Strip/Clean equipment (200 & 300mm lines)

Qualifications and training

• Degree or post graduate in Physics / Electronics / Semicon / Chemistry to BSc level or higher
• Strong MS Office skills
• SQL / JMP / Minitab experience

Skills and experience

• Experience with MES (Manufacturing Execution Software)
• Experience with Microsoft Office Suite
• Previous working experience within a Semiconductor facility, preferably 24/7 operations.
• Experience with statistical tools such as MATLab, Minitab or SAS-JMP.
• Understanding of the importance of any Engineering improvements or work on the functionality of our devices.
• Engineering level understanding of a variety of Wet-Etch / Strip / Wet-Clean equipment in a semiconductor facility.